Method for treating noxious gases discharged during semiconductor material production, involves partially converting noxious gas to process gas by using reactant, so that heat energy of gases is used partially for reactant evaporation

摘要

The noxious gases are partially converted into process gas, by using a reactant, such that the heat energy of the process gas and/or the noxious gas is used at least partially for the evaporation of the reactant. The thermal energy of the process gas and/or the noxious gas is supplied indirectly to the reactant. The thermal energy of the process gas and/or the noxious gas is transferred to the aerosol-form reactant. The treatment method is carried out with a reactor (4). The reactant is guided in thermal contact to the inlet on the upper end region (4.2) of the reactor. An independent claim is included for a device for treating noxious gases.