Device, useful for laser cutting of workpiece, comprises a cutting head, and an adjusting unit, where the cutting head is guided along a cutting line relative to a workpiece in a cutting direction and contains a deflecting mirror

摘要

The device comprises a cutting head (4) guided along a cutting line relative to a workpiece (10) in a cutting direction, where a lens (8) is arranged, in the cutting head, for focusing laser beam bundles produced by a laser beam source (2), and an unit for adjusting a predeterminable incidence angle between normals perpendicular to a surface of the workpieces at the focus of the focused laser beam bundle and a component of a central beam of the focused laser beam bundle lying in a plane perpendicular to the cutting direction. The device comprises a cutting head (4) guided along a cutting line relative to a workpiece (10) in a cutting direction, where a lens (8) is arranged, in the cutting head, for focusing laser beam bundles produced by a laser beam source (2), and an unit for adjusting a predeterminable incidence angle between normals perpendicular to a surface of the workpieces at the focus of the focused laser beam bundle and a component of a central beam of the focused laser beam bundle lying in a plane perpendicular to the cutting direction. The central beam of the laser beam bundle spreads within the cutting head before the focusing lens parallel to an optical axis. The adjusting unit is provided for generating an offset perpendicular to the cutting direction, where the offset is present between the optical axis and the central beam of the laser beam bundle propagating parallel to the optical axis for the focusing lens. The cutting head, for generating the offset, contains a deflecting mirror (6) movably arranged perpendicular to the optical axis. The focusing optics, for generating the offset, is movably/transversely mounted to the optical axis. The workpiece is pivotally mounted about an axis vertical to the optical axis of the focusing lens.