A device for heat dissipation for at least one electronic component and corresponding

摘要

A heat-sink device intended for at least one electronic component (12), includes: a heat-sink; a substrate (11) for the at least one electronic component (12), said substrate covering the heat-sink; and thermal coupling provided between the substrate and the heat-sink and made from a material different from that of the heat-sink. The heat-sink comprises of a set of independent fins (10), and the thermal-coupling (13) is made from a heat-conductive polymer material and also serve as mechanical coupling between the substrate (11) and the fins (10).