Copper alloy compound, useful for molding parts and in health care products, and to fight against proliferation of micro-organisms e.g. Staphylococcus aureus, Clostridium difficile and Enterobacter aerogenes

摘要

Copper alloy compound, is claimed. Copper alloy compound of formula (Cu aZn bMn cAl dX e), is claimed. a : 50-70 (preferably 59-62) mass%; b : 20-40 (preferably 25-31) mass%; c : 5-15 (preferably 9-11) mass%; d : 0.1-2 (preferably 0.2-1) mass%; X : inevitable impurities found in alloy; and e : less than 0.40 (preferably less than 0.15) mass%. An independent claim is included for obtaining copper alloy comprising subjecting the copper 50-70 (preferably 59-62) mass% and the manganese 5-15 (preferably 9-11) mass% at a temperature of 1200[deg] C until fusion, then adding aluminum 0.1-2 (preferably 0.2-1) mass% and zinc 20-40 (preferably 25-31) mass%, subjecting the mixture to the temperature of 1000-1100[deg] C, taking a sample of the mixture to carry out a spectrometric analysis and to control the proportions of the alloy components, adjusting the proportions of copper, manganese, zinc and/or aluminum, and casting the alloy.