Assembling module of analysis device of biological sample, comprises applying external formwork to upper face, and coating conductor by encapsulation material to deposit material in cavity delimited by internal wall of external formwork

摘要

The method comprises envisaging a plane dielectric support comprising a face conducting line intended to be connected to a connection stud of an electronic component (15), applying an inactive face of an electronic component to an upper face of the support via an adhesive (14), connecting the connection stud of the electronic component to the conducting line by a conductor (16), applying an external formwork to the upper face, and coating the conductor by an encapsulation material (17a, 17b) to deposit the material in the cavity delimited by an internal wall of the external formwork. The method comprises envisaging a plane dielectric support comprising a face conducting line intended to be connected to a connection stud of an electronic component (15), applying an inactive face of an electronic component to an upper face of the support via an adhesive (14), where the electronic component comprises an active face (15t) comprising a first annular and peripheral area to contain the connection stud and a main and central area, connecting the connection stud of the electronic component to the conducting line by a conductor (16), applying an annular external formwork to the upper face of the support, where the external formwork encircles a space designed to accommodate the electronic component and to cooperate with the upper face of the support to form a cavity delimited by an internal wall of the external formwork, and coating the conductor by an encapsulation material (17a, 17b) to deposit the material in the cavity delimited by the internal wall of the external formwork. The external formwork presents the internal wall of which a height is greater than a maximum height of a unit consisted of the conductor after its connection to the electronic component. The coating step comprises: depositing a first quantity of the encapsulation material to fill an open space within the cavity delimited by the internal wall of the external formwork and a side wall of the electronic component; hardening the first quantity of the encapsulation material, applying an annular interior formwork to the active face of the electronic component; where the interior formwork presents an internal diameter lower than the diameter of the main and central area of the active face of the electronic component, an external wall of the interior formwork has a height equal even to or greater than that of the internal wall of the external formwork; and depositing a second quantity of the encapsulation material to fill the cavity delimited by the internal wall of the external formwork and the external wall of the interior formwork. The method further comprises hardening a second quantity of the deposited encapsulation material; machining the interior formwork and the exterior formwork to satisfy constraints with an assembly; and cutting out module assembled to satisfy constraints with dimensions and forming die. The step of applying the external formwork comprises depositing: a first annular external formwork presenting an inner wall whose height is approximately equal to a lateral wall of an increased thickness of the adhesive cooperating with the inactivate face; and a second annular external formwork having external and internal diameters and an internal wall of which the height is such that height of an internal wall resulting from the assembly of the first and second external formwork is higher with the maximum height of the unit consisted of the conductor after its connection to the electronic component, where the second external formwork is applied to the first external formwork at the conclusion of the step to harden the first quantity of the encapsulation material, and depositing a first polymerizable thermal resin of strong viscosity. The hardening step is carried out by cooking the first resin of strong viscosity prior to the step to apply the encapsulation material. The steps to deposit the encapsulation material comprise depositing a polymerizable resin of low viscosity. The step to apply the interior formwork comprises depositing a second polymerizable resin of strong viscosity. The step to harden comprises cooking the second resin of strong viscosity prior to the step of applying the second quantity of the encapsulation material. The connection step is carried out by a beam. The envisaging step comprises choosing the support comprising the conducting line placed on the upper face of the support and cooperating with the conducting line placed on the face opposed to the upper face of the support by the beam, and using a film. Independent claims are included for: (1) a method for producing a device of analysis of a biological sample; (2) a module for a device of analysis of a biological sample; and (3) a device for analysis of a biological sample.