Heat resistant low birefringence polyimide copolymer film

摘要

A class of solvent resistant, flexible copolyimide substrates having high optical transparency (80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (0.001) and a maximum CTE of approximately 60 ppm/° C. is disclosed. The copolyimides are prepared from alicyclic dianhydrides, aromatic cardo diamines, and aromatic diamines containing free carboxyl groups. The substrates are manufactured from solutions of the copolyimides containing multifunctional epoxides in the form of single layer films, multilayer laminates and glass fiber reinforced composite films. The substrates can be used in the construction of flexible optical displays, and other microelectronic and photovoltaic devices that require their unique combination of properties.