首页> 外国专利> Being the additional strength sheet for the resin molded article and the additional strength sheet for the resin molded article which has

Being the additional strength sheet for the resin molded article and the additional strength sheet for the resin molded article which has

机译:作为用于树脂成型品的附加强度片和用于树脂成型品的附加强度片,其具有

摘要

PROBLEM TO BE SOLVED: To provide a lightweight reinforcing sheet for a resin molded product, lightweight and easily reinforcing the resin molded product while preventing the degradation or melting of the resin molded product by heating at a comparatively low temperature without impairing appearance, and a reinforcing structure and a reinforcing method for the resin molded product.;SOLUTION: The reinforcing sheet 1 for the resin molded product includes a restriction layer 3, and a reinforcing layer 2 laminated on the restriction layer 3 and formed of a heat-adhesive type adhesive composition containing a polymer with a monomer containing conjugated dienes, and a tackifier. The reinforcing layer 2 is stuck to a polypropylene plate with a thickness of 2.0 mm and heated at 80°C for 10 minutes. The reinforcing sheet 1 with a flexural strength of 3 N or higher at a displacement of 1 mm after heating and a maximum flexural strength of 30 N or higher, is stuck to the resin molded product 4 and heated at 80-100°C. The restriction layer 3 and the resin molded product 4 can thereby firmly stick to each other through the reinforcing layer 2, and the resin molded product 4 can be surely reinforced by the reinforcing sheet 1 for the resin molded product.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:为了提供用于树脂模制产品的轻质增强片,轻质且容易地增强树脂模制产品,同时通过在不损害外观的情况下通过在较低的温度下加热来防止树脂模制产品降解或熔化,并增强解决方案:用于树脂模制产品的增强片1包括限制层3和层压在限制层3上并由热粘合型粘合剂组合物形成的增强层2。含有聚合物和含有共轭二烯的单体,以及增粘剂。将增强层2粘附到厚度为2.0mm的聚丙烯板上,并在80℃下加热10分钟。加热后的挠曲强度为3N以上,加热后的位移为1mm,最大挠曲强度为30N以上的增强片1粘贴在树脂成形品4上,并在80〜100℃下进行加热。由此,限制层3和树脂成型品4可以通过加强层2牢固地粘接,并且可以通过用于树脂成型品的加强片1来可靠地加强树脂成型品4。版权所有:(C) 2010,日本特许厅

著录项

  • 公开/公告号JP5489571B2

    专利类型

  • 公开/公告日2014-05-14

    原文格式PDF

  • 申请/专利权人 日東電工株式会社;

    申请/专利号JP20090175744

  • 发明设计人 間瀬 拓也;藤井 隆裕;

    申请日2009-07-28

  • 分类号B32B25/16;B32B27/00;

  • 国家 JP

  • 入库时间 2022-08-21 16:16:21

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