首页> 外国专利> HEAT-RESISTIVE POLYIMIDE RESIN, AND SEAMLESS PIPE BODY, COATED FILM, COATED PLATE AND HEAT-RESISTIVE COATING USING THE SAME

HEAT-RESISTIVE POLYIMIDE RESIN, AND SEAMLESS PIPE BODY, COATED FILM, COATED PLATE AND HEAT-RESISTIVE COATING USING THE SAME

机译:耐热聚酰亚胺树脂,无缝管体,涂层膜,涂层板和使用相同涂层的耐热涂层

摘要

PROBLEM TO BE SOLVED: To provide a polyimide-based heat-resistive resin composition capable of forming a coated film and a seamless pipe body excellent in tear strength and elongation.;SOLUTION: A polyimide resin is obtained by reacting an aromatic diamine and an aromatic tetracarboxylic dianhydride, wherein the aromatic diamine contains ≥5 eq% of 2,3'-diaminodiphenyl ether represented by the following structural formula based on the whole aromatic diamine amount; and a coated film composed of the polyimide resin has a tear strength at 23°C of ≥5 N/mm, and a tensile elongation at 23°C of ≥50%.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种聚酰亚胺类耐热树脂组合物,该组合物能够形成涂膜以及撕裂强度和伸长率优异的无缝管体。;解决方案:通过使芳族二胺与芳族化合物反应获得聚酰亚胺树脂。四羧酸二酐,其中芳族二胺包含≥5eq%的由以下结构式表示的2,3'-二氨基二苯醚,基于全部芳族二胺的量;由聚酰亚胺树脂组成的涂膜在23°C时的撕裂强度≥5N / mm,在23°C时的拉伸伸长率≥50%。;版权所有:(C)2014,JPO&INPIT

著录项

  • 公开/公告号JP2013237795A

    专利类型

  • 公开/公告日2013-11-28

    原文格式PDF

  • 申请/专利权人 HITACHI CHEMICAL CO LTD;

    申请/专利号JP20120112393

  • 发明设计人 YOTSUYA SEIICHI;

    申请日2012-05-16

  • 分类号C08G73/10;C09D179/08;C09D7/12;

  • 国家 JP

  • 入库时间 2022-08-21 16:16:02

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