Fracturing method and fracturing equipment and vehicle window glass obtained by the cleaving method of brittle material substrate

摘要

The cutting method and cutter device of offer are used for brittle material substrate, can be cut by the brittle material substrate, can increase device complication with mass and road section, and the method for the window glass for vehicle obtained by cutting. A kind of cutting brittle material substrate G is along the first and second cutting line (L1-1, L1-2), these at least place's intersections on one point each other, wherein this method includes first step, (G1) is used to form on scribing line (L2-1 and L2-2) along the first and second cutting line (L1-1, L1-2), second step, it is along in the scribing line (L2-1 and L2-2) that (G1) is wherein relatively moved on laser beam irradiation position (one), by the moving direction of the irradiation position (one) of substrate G cuttings upstream side, wherein the irradiation of laser beam be limited inside region (J and K) those close to crosspoint (C and D), here, first and second cut line (L1-1, (L1-10 intersects.