Heat dissipation and copper alloy sheet excellent in repetitive bending property

摘要

PROBLEM TO BE SOLVED: To provide a copper alloy sheet as a heat dissipation part for a flexible printed circuit board, a liquid crystal frame and the like, having excellent heat dissipation, electro conductivity, repeated bendability and shape retainment.;SOLUTION: Provided is a copper alloy sheet that contains Ag by 0 to 1.0 weight %, Ti by 0 to 0.08 weight %, Ni by 0 to 2.0 weight %, Zn by 0 to 3.5 weight %, and one or more of Cr, Fe, In, P, Si, Sn, and Zr by 0 to 0.5 weight % in total, and the remainder is composed of Cu and unavoidable impurities, in which the electric conductivity is 60% IACS or more, the tensile strength is 350 MPa or more, and regarding Euler angle (φ1, Φ, φ2), which is a set of angles at which ND, TD, RD of a material and [001], [010], [100] of a crystal coincide by rotating by φ1 with an ND axis as a rotation axis, followed by rotating by Φ in order to have the ND axis and a z axis to coincide, and finally rotating by φ2 around a [001] axis, the pole density of crystal orientation in Euler angle (40, 45, 0) is 18 or less.;COPYRIGHT: (C)2014,JPO&INPIT