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Vis-a-vis the entire tonnage of the flux constituent, the lead free solder constituent and the resin entering

机译:相对于助焊剂成分,无铅焊料成分和进入的树脂的总吨位

摘要

The flux composition for the lead free solder of this invention dehydroacetic abietic acid 8 - 65 weight %, is the composition which 8 - 67 weight % contains jihidoroabiechin vis-a-vis the entire quantity of the composition. As for this flux composition, when amount used of the activator is decreased, insulating resistance of the flux residue in regard to utility sufficiently is high, in addition, gets wet and spreads and characteristic satisfactory, namely it is something which can obtain the solder composition whose solderability is satisfactory. In addition, as for the flux composition for the lead free solder of this invention, after the soldering when it seals with various seal resin and the like, it is something which can obtain the solder composition which does not obstruct hardening the particular seal resin.
机译:本发明的无铅焊料脱氢乙酸松香酸的焊剂组合物为相对于组合物总量为8〜67重量%的含有多巴酚丁二酮的组合物。该助焊剂组合物,如果减少活化剂的使用量,则就实用性而言,助焊剂残渣的绝缘电阻充分高,另外,润湿扩散,特性令人满意,即可以得到焊料组合物。其可焊性令人满意。另外,本发明的无铅焊料用助焊剂组合物,在用各种密封树脂等进行密封后的钎焊后,可以得到不会阻碍特定的密封树脂固化的焊料组合物。

著录项

  • 公开/公告号JP5423688B2

    专利类型

  • 公开/公告日2014-02-19

    原文格式PDF

  • 申请/专利权人 荒川化学工業株式会社;

    申请/专利号JP20100548506

  • 发明设计人 久保 夏希;岩村 栄治;

    申请日2010-01-26

  • 分类号B23K35/363;

  • 国家 JP

  • 入库时间 2022-08-21 16:12:21

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