The epoxy resin which the conduction of heat hardened material and the heat dissipation substrate which uses this and

摘要

PROBLEM TO BE SOLVED: To solve the problem of greatly limited use of a conventional heat dissipation substrate which uses a crystalline resin and is hardly usable for a circuit board and the like requiring predetermined shock resistance, since the crystalline resin itself is hard and brittle.;SOLUTION: A thermally conductive material 17 comprising an epoxy resin containing 40 vol.% or more of a crystalline epoxy resin, a curing agent, an incombustible epoxy resin in an amount of 3-12 vol.% of the total of the epoxy resin and the curing agent, a thermoplastic resin in amount of 0.3-2.5 vol.% of the total of the epoxy resin and the curing agent, an inorganic filler in an amount of 70-88 vol.% of the total of the epoxy resin, the curing agent, and the nonflammable epoxy resin, and a nonflammable assistant filler in amount of 0.6-2.5 vol.% of the total of the epoxy resin and the curing agent, is used for a thermally conductive insulating layer 11, and thereby the heat dissipation substrate excellent in all of high thermal conductivity, high flame resistance, and high shock resistance can be obtained.;COPYRIGHT: (C)2009,JPO&INPIT