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Observation device and void observation method
Observation device and void observation method
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机译:观察装置和空隙观察方法
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摘要
A disclosed observation apparatus for observing a void generated in an underfill resin upon mounting a body to be mounted on a substrate via the underfill resin in flip-chip mounting includes: a mounting unit mounting the body to be mounted on the substrate; and an observation unit observing behavior of the underfill resin while the mounting unit is mounting the body to be mounted on the substrate.
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