A technique for tracking changes in bias conditions of a microelectromechanical system (MEMS) device includes applying an electrode bias signal to an electrode of the MEMS device. The technique includes applying a mass bias signal to a mass of the MEMS device suspended from a substrate of the MEMS device. The technique includes generating the mass bias signal based on a target mass-to-electrode bias signal level and a signal level of the electrode bias signal.
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