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Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing
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机译:在用于半导体加工的钛或钛合金上形成锌钝化层
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摘要
Embodiments of the current invention describe methods of processing a semiconductor substrate that include applying a zincating solution to the semiconductor substrate to form a zinc passivation layer on the titanium-containing layer, the zincating solution comprising a zinc salt, FeCl3, and a pH adjuster.
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