首页> 外国专利> CHIPPING-PROOF INORGANIC SOLID-STATE MATERIAL AND CHIPPING-PROOF EDGE TOOL

CHIPPING-PROOF INORGANIC SOLID-STATE MATERIAL AND CHIPPING-PROOF EDGE TOOL

机译:防切削无机固体材料和防切削边缘工具

摘要

A chipping-proof nonmetal inorganic solid-state material is characterized in that the inorganic solid-state material has, in at least a part of a surface thereof, a surface structure in which a network of recesses and protuberances surrounded by the recesses are formed, the protuberances have an average width of 5 nm to 50 nm, a physical property of the surface structure differs from the physical property of an interior of the inorganic solid-state material lying below the surface structure, and there is no solid-solid interface between the surface structure and the interior of the inorganic solid-state material.
机译:防碎裂非金属无机固态材料的特征在于,所述无机固态材料在其表面的至少一部分中具有表面结构,在该表面结构中形成有凹部和由凹部包围的突起的网络,突起的平均宽度为5nm至50nm,表面结构的物理性质不同于位于表面结构下方的无机固态材料内部的物理性质,并且之间没有固-固界面无机固态材料的表面结构和内部。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号