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Two stage serial impingement cooling for isogrid structures

机译:等距结构的两级串联冲击冷却

摘要

A system for cooling a wall (24) of a component having an outer surface with raised ribs (12) defining a structural pocket (10), including: an inner wall (26) within the structural pocket and separating the wall outer surface within the pocket into a first region (28) outside of the inner wall and a second region (40) enclosed by the inner wall; a plate (14) disposed atop the raised ribs and enclosing the structural pocket, the plate having a plate impingement hole (16) to direct cooling air onto an impingement cooled area (38) of the first region; a cap having a skirt (50) in contact with the inner wall, the cap having a cap impingement hole (20) configured to direct the cooling air onto an impingement cooled area (44) of the second region, and; a film cooling hole (22) formed through the wall in the second region.
机译:一种用于冷却具有外表面的组件的壁( 24 )的系统,该外表面带有限定结构袋( 10 )的凸起肋( 12 )包括:结构凹穴内的内壁( 26 ),并将凹穴内的壁外表面分为内壁外侧的第一区域( 28 )和第二区域( 40 )被内壁包围;一块板( 14 )放置在凸起的肋骨上并封闭结构袋,该板具有板撞击孔( 16 ),用于将冷却空气引导到撞击冷却区域( 38 )的第一个区域;具有与内壁接触的裙部( 50 )的帽,帽具有帽撞击孔( 20 ),该帽撞击孔被构造成将冷却空气引导到撞击冷却区域上( 44 )的第二个区域,以及;穿过第二区域中的壁形成的薄膜冷却孔( 22 )。

著录项

  • 公开/公告号US8826668B2

    专利类型

  • 公开/公告日2014-09-09

    原文格式PDF

  • 申请/专利权人 CHING-PANG LEE;JAY A. MORRISON;

    申请/专利号US201113195947

  • 发明设计人 CHING-PANG LEE;JAY A. MORRISON;

    申请日2011-08-02

  • 分类号H01L23/46;F23R3/06;F01D9/02;F01D25/12;F01D5/18;

  • 国家 US

  • 入库时间 2022-08-21 16:02:17

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