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Use of polyamide thermal plastics as low cost electronics potting compounds for munitions applications
Use of polyamide thermal plastics as low cost electronics potting compounds for munitions applications
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机译:聚酰胺热塑料作为弹药应用的低成本电子灌封材料
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摘要
The present invention is directed to use of a polyamide thermal plastic as a potting compound for potting electronic components (ex.—printed circuit boards) of an electronics assembly which is implemented in a munition. Use of the polyamide thermal plastic as a potting compound allows for a gun-hardened electronics assembly. Use of the polyamide thermal plastic as a potting compound also allows for reworkability. For example, during early testing phases of the electronics assembly, the potting material of the present disclosure may be removable (ex.—such as via a hot solvent bath) from the electronics assembly so that the electronics components may be: examined to determine the cause(s) for low yield during testing; and/or fixed, rather than having to rebuild the entire electronics assembly, thereby promoting lower costs of producing the electronics assembly.
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