首页> 外国专利> Method for connecting a first substrate to a second substrate, a set of substrates, kit for the method to connect a first substrate to a second substrate, promoter of accession to a composition of primer, the method stops to improve the performance of a primer composition and composition Primer

Method for connecting a first substrate to a second substrate, a set of substrates, kit for the method to connect a first substrate to a second substrate, promoter of accession to a composition of primer, the method stops to improve the performance of a primer composition and composition Primer

机译:将第一基底连接至第二基底的方法,一组基底,用于将第一基底连接至第二基底的方法的试剂盒,引物组合物的加入促进剂,该方法停止改进引物组合物的性能和组成底漆

摘要

A composition and method for bonding to a substrate. In general applied to a substantially transparent substrate will be a primer composition that includes a reaction product prepared by the reactionof at least one isocyanate including a thiophosphate with an amino-silane, a mercapto-silane, or a combination thereof.
机译:用于结合至基底的组合物和方法。通常应用于基本透明的基材的是底漆组合物,其包括通过至少一种包括硫代磷酸酯的异氰酸酯与氨基硅烷,巯基硅烷或其组合反应制备的反应产物。

著录项

  • 公开/公告号BRPI0809711A2

    专利类型

  • 公开/公告日2014-10-07

    原文格式PDF

  • 申请/专利权人 DOW GLOBAL TECHNOLOGIES INC.;

    申请/专利号BR2008PI09711

  • 发明设计人 ARCANGELO BIGHETTI;DIRK SCHWOEPPE;

    申请日2008-02-19

  • 分类号C08G18/28;C08G18/77;C09J175/04;

  • 国家 BR

  • 入库时间 2022-08-21 15:58:34

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