'PROCESS OF USING UV LED (ULTRA VIOLET LIGHT EMISSION DIODE) CURING TECHNOLOGY IN FLEXIBLE PACKAGING OF LAMINATES MONOLAYER AND MULTILAYER FILM.'

摘要

The present invention for an Effective offline coating and/ or curing of surface printed flexible packaging substrate coated with UV LED (Ultra Voilet Light Emiiting Diode) curable over print Varnish using UV LED as a curing source which emits radiation that assists in the curing process depending upon the wave length of the radiation emitted by the UV LED light results in minimum heating of the curing surface.