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SPUTTERING TARGET WITH BONDING LAYER OF VARYING THICKNESS UNDER TARGET MATERIAL
SPUTTERING TARGET WITH BONDING LAYER OF VARYING THICKNESS UNDER TARGET MATERIAL
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机译:目标材料下厚度变化的结合层的溅射目标
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摘要
Certain example embodiments of this invention relate to a rotatable magnetron sputtering target(s) for use in sputtering material(s) onto a substrate. In certain example embodiments, the target includes a cathode tube with a target material applied thereto via plasma spraying or the like. A bonding layer is provided on the tube, between the cathode tube and the target material. The bonding layer is thicker proximate at least one end portion of the target than at a central portion of the target in order to reduce the likelihood of burn-through to or of the cathode tube during sputtering.
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