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Multi-chip LED package with a spectral and quantitative detection capability in the package and digital signal output

机译:多芯片LED封装,在封装和数字信号输出中具有光谱和定量检测功能

摘要

Package (10) of multi-chip light-emitting diodes, comprising: a support element (12); a plurality of chips (14) of light emitting diodes disposed on the support element (12) a sensor (15) disposed on the support element (12) to notify a signal to a controller (30), the reference signal being at the light output of the chips (14) of light emitting diodes; wherein the sensor (15) produces an analog signal output and further comprising a signal processing circuit (20) arranged on the support element (12) to convert the analog signal output produced by the sensor (15) on a digital signal output.
机译:多芯片发光二极管的封装(10),包括:支撑元件(12);多个发光二极管芯片(14)布置在支撑元件(12)上,传感器(15)布置在支撑元件(12)上,以将信号通知控制器(30),参考信号处于发光状态发光二极管芯片(14)的输出;其中,传感器(15)产生模拟信号输出,并且还包括布置在支撑元件(12)上的信号处理电路(20),以将由传感器(15)产生的模拟信号输出转换为数字信号输出。

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