HEAT SINK WITH MICROCHANNEL COOLING FOR POWER DEVICES

摘要

An apparatus for cooling at least one heated surface includes a base platedefining a number of inlet and outlet manifolds. The inlet manifolds areconfigured to receive a coolant, and the outlet manifolds exhaust the coolant.The inlet and outlet manifolds are interleaved. The apparatus also includes atleast one substrate having inner and outer surfaces. The inner surface iscoupled to the base plate and defines a number of microchannels that receivethe coolant from the inlet manifolds and deliver the coolant to the outletmanifolds. The microchannels are oriented substantially perpendicular to theinlet and outlet manifolds. The outer surface is in thermal contact with theheated surface. The apparatus also includes an inlet plenum that supplies thecoolant to the inlet manifolds, and an outlet plenum that exhausts the coolantfrom the outlet manifolds. The inlet plenum and outlet plenum are oriented ina plane of the base plate.