PLATE SUBSTRUCTURE FOR AREA-WIDE LAYING OF PIPELINES FOR HEATING, COOLING OR ABSORBING PURPOSES, FOR EXAMPLE FOR FLOOR OR WALL HEATING, AND METHOD FOR MANUFACTURING SUCH HEATING

摘要

The invention relates to a plate substructure (1) for area-wide laying of pipelines (18) for heating, cooling or absorbing purposes, for example for floor or wall or ceiling heating, comprising a plate-like thermal insulation (3) with notches (11) of U-shaped cross section formed therein, wherein a flat heat conduction plate (16) is applied to the top of the thermal insulation (3), said plate comprising grooves (17) for holding the pipelines (18), said grooves having a U-shaped cross section and being placed into the U-shaped notches (11) in fitted fashion. The thermal insulation comprises a first surface element (2) with a top side and a bottom side, said element comprising closely adjacent channel spaces (26) formed from at least one corrugated web (4, 5, 6), said spaces being parallel with one another and filled with air, wherein the notches (21) for holding the pipelines (18) are formed into the surface element (2) starting from the top side. The heat conduction plate (16), with the grooves (17) placed into the notches (11) in fitted fashion is disposed on the top side of the surface element (2), a second surface element (3) is disposed on the bottom side of the first surface element (2) below the notches (11), said second surface element comprising further closely adjacent channel spaces (27) that are parallel to one another, said channel spaces (27) comprised of at least one corrugated web (12, 13, 14) and being filled with a fine-grained filler material (15) and being sealed shut at the edges.