HIGH CUTTING FORCE DIAMOND MICROPOWDER AND PREPARATION METHOD THEREOF

摘要

The present invention provides a high cutting force diamond micropowder and preparation method thereof. The high cutting force diamond micropowder of the present invention has a lot of sharp cutting blades on the particles surface and the cutting force of the said high cutting force diamond micropowder is 2-4 times of those of normal single crystal diamond micropowder. The specific surface areas of the diamond micropowders in the product of the present invention with average particle size of 3 μm, 6 μm, 9 μm, 15 μm and 30 μm are much larger than those of normal single crystal diamond micropowders with average particle size of 3 μm, 6 μm, 9 μm, 15 μm and 30 μm respectively. The high cutting force diamond micropowder of the present invention has strong cutting force and long service life and after grinding and polishing the scuffing on the surface of the workpiece is few, which meets the requirement of modern industry on grinding and polishing with high efficiency and high precision. It would improve the development of the technology of precision grinding and polishing. The product of the present invention is mainly used in precision grinding and polishing in a variety of industries such as IT, optical communication, LED, aerospace, and vehicles.