DEFECT OCCURRENCE PROCESS ANALYSIS DEVICE AND DEFECT OCCURRENCE PROCESS ANALYSIS METHOD

摘要

This defect occurrence process analysis device is provided with: a mapping unit (521) which maps final defect information obtained in a final inspection process to coordinates set on a member according to defect type; an association unit (522) which associates intermediate defect information obtained in an intermediate inspection process and corrected result information obtained after a correction process for a defect detected in the intermediate inspection process has been performed with each other; a classification mapping unit (524) which, on the basis of the result of the classification of the intermediate defect information by a classification unit (523), maps the intermediate defect information to the coordinates set on the member according to the corrected result information; and a map display unit (525) which displays respective maps generated by the mapping unit (521) and the classification mapping unit (524) on the process-by-process basis.The present invention is applicable to manufacturing processes for an organic EL display panel and a liquid crystal display panel.