METHOD FOR MANUFACTURING HEAT-DISSIPATING PLATE HAVING EXCELLENT HEAT CONDUCTIVITY IN THICKNESS DIRECTION AND HEAT-DISSIPATING PLATE MANUFACTURED BY METHOD

摘要

The present invention relates to a method for manufacturing a heat-dissipating plate having excellent heat conductivity in the thickness direction and suitably used as a heat sink for preventing performance deterioration of LED chips, semiconductor components, and high-power electronic equipment. The method for manufacturing the heat-dissipating plate, according to the present invention, comprises the steps of: (a) coating plate-shaped graphite powder with metal; (b) enabling the plate-shaped graphite powder to be oriented in the horizontal direction by applying vibration to the metal-coated graphite powder; (c) pressurizing and molding the graphite powder oriented in the horizontal direction; (d) producing bulk material by sintering the pressurized graphite powder; and (e) producing a plate by cutting the bulk material in the vertical direction with respect to the horizontally oriented direction at a certain thickness.