Board for a hot-water floor according to the present invention comprises: a panel; and a passage which is formed lengthwise in the center of the lower part of the panel and allows hot water to flow in; multiple heat accumulation spaces formed inside the panel in a longitudinal direction so as to accumulate the heat of the hot water flowing in the passage; a heat diffusion body formed in the panel to uniformly transfer the heat of the hot water flowing in the passage to an upper part of the panel; and combining parts formed at both ends of the panel to combine the panels widthwise.
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