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Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING HIGH DIE ABRASION RESISTANCE AND GOOD SHEAR PROCESSABILITY AND METHOD FOR PRODUCING SAME
Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING HIGH DIE ABRASION RESISTANCE AND GOOD SHEAR PROCESSABILITY AND METHOD FOR PRODUCING SAME
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机译:具有高模头耐磨性和良好剪切加工性的Cu-Ni-Si基铜合金薄板及其制造方法
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摘要
A Cu-Ni-Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass% to 4.0 mass% of Ni is contained, 0.2 mass% to 0.9 mass% of Si is contained, the remainder is made up of Cu and inevitable impurities, the number of Ni-Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm on a surface is in a range of 1.5×106 particles/mm2 to 5.0×106 particles/mm2, the number of Ni-Si precipitate particles having a grain diameter of greater than 100 nm on the surface is in a range of 0.5×105 particles/mm2 to 4.0×105 particles/mm2, in a case in which the number of the Ni-Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni-Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5, and the concentration of Si forming a solid solution in crystal grains in an area that is less than 10 µm thickness from the surface is in a range of 0.03 mass% to 0.4 mass%.
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机译:本发明的Cu-Ni-Si基铜合金薄板在保持强度和导电性的同时具有优异的耐模具磨损性和剪切加工性,其中包含1.0质量%至4.0质量%的Ni,0.2质量%至0.9质量%的Ni。包含Si,其余部分由Cu和不可避免的杂质组成,表面上粒径在20 nm至80 nm范围内的Ni-Si沉淀颗粒的数量在1.5×10范围内。 6 Sup>颗粒/ mm 2 Sup>到5.0×10 6 Sup>颗粒/ mm 2 Sup>,Ni-Si沉淀颗粒的数量为表面上大于100 nm的晶粒直径在0.5×10 5 Sup>颗粒/ mm 2 Sup>到4.0×10 5 Sup>颗粒的范围内/ mm 2 Sup>,其中在厚度为20%的表面层中,具有20-80 nm范围内的粒径的Ni-Si沉淀颗粒的数量从表面到整个片材的厚度用粒子/ mm 2 Sup>表示,并且表面层以下的部分的粒径为20nm〜80nm的Ni-Si析出粒子的数量以b个粒子/ mm 2 Sup>表示,a / b为在0.5至1.5的范围内,并且在从表面到小于10μm厚度的区域中的在晶粒中形成固溶体的Si的浓度在0.03质量%至0.4质量%的范围内。
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