EPOXY ACRYLATE RESIN, ACID ANHYDRIDE ADDUCT OF EPOXY ACRYLATE, CURABLE RESIN COMPOSITION, ALKALI-DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION, AND CURED OBJECT THEREOF

摘要

Provided is epoxy acrylate desired for uses such as a material for a circuit board by adding an cured object having excellent reliability such as solder thermal resistance, slight of a coating material, adhesion, and chemical resistance. Furthermore, provided are an acid adduct and a composition thereof. The purpose of the present invention is to provide: an epoxy acrylate resin gained by reacting (meth)acrylic acid with an epoxy resin derived from a compound substituting a benzene ring aralkyl group of bisphenol F or a novolac type phenol resin; an acid anhydride adduct of epoxy acrylate gained by esterification of at least a part of OH group of the epoxy acrylate resin using polyhydroxy carboxylic acid anhydride; and a curable resin composition or a alkali-developable photosensitive resin composition including the resin and the initiative thereof.;COPYRIGHT KIPO 2014