Soldering finishing device and ultrasonic soldering apparatus comprising the same

摘要

Disclosed is a soldering finishing apparatus removing surplus solder from a soldering object. According to the present invention, a soldering finishing apparatus includes: a first rotating plate; a first brush unit having a first brush combined on one surface of the first rotating plate along a circumferential direction; a second brush unit having a second rotating plate facing the first rotating plate apart from each other and a second brush combined on one surface of the second rotating plate facing the first rotating plate along a circumferential direction; and a driving unit rotating the first and second rotating plates on the same axis. According to the present invention, the soldering finishing apparatus can easily reduce the time required to remove surplus solder because the surplus solder formed in the soldering object, such as a terminal, and can significantly increase entire productivity because of high work safety.