A method for increasing the thermomechanical stability of a metal-ceramic, substrate

摘要

The present invention relates to a method for increasing the thermomechanical stability of a metal-ceramic, substrate, the metallization of a thickness of from ≧ 100 μm on a substrate or a layer of a ceramic material. In the method, after the application and, if appropriate, structuring of the metallization edges which, between the metallization and the substrate or of the layer to occur, by means of application of an electrically insulating filling material covered on the edges. As a result, initial cracks and resulting from the defective at these points filled with the filler material. The resulting substrates are in their resistance to cracks is greatly improved, so that they have a higher thermomechanical reliability.