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Method for applying an electrically conductive and optically transparent metal layer, a substrate with this metal layer and its use

机译:涂覆导电且光学透明的金属层的方法,具有该金属层的基板及其用途

摘要

Method for applying an electrically conductive and optically transparent metal layer with a layer thickness of less than 20 nm on a substrate, in which the deposition of the metal layer on the surface of the substrate under vacuum with an electric arc discharge between a target connected as a cathode, which is made from the metal of the metal layer to be formed is formed, and an anode is formed and operated with an electrical current of at least 1.5 kA, and that the ions formed in the arc discharge and used to deposit the metal layer are filtered through a filter, in the larger particles are separated, and that the diffusion of the ions on the substrate surface is reduced by subplantation of the ions in the substrate, characterized in that the layer is deposited in a structured manner in the layer plane.
机译:在基板上施加厚度小于20 nm的导电且光学透明的金属层的方法,其中在真空下通过电弧放电将金属层沉积在基板表面上,靶之间连接形成由要形成的金属层的金属制成的阴极,并形成阳极并以至少1.5 kA的电流操作,并且在电弧放电中形成的离子用于沉积阳极。金属层通过过滤器过滤,在较大的颗粒中分离,并且通过将离子亚植入到基底中来减少离子在基底表面上的扩散,其特征在于该层以结构化的方式沉积在基底中。层平面。

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