Method for manufacturing micro-electromechanical system (MEMS), involves forming electrical interconnections between cavity disc and circuitry disc, and enabling completion of element by standard methods and connection technique

摘要

The method involves processing circuitry disc with typical working steps of MEMS manufacture on the other surface, which is subsequently returned inward, for the creation of cavities in layer association to the cavities of sensor disc, when formation of perforation is necessary. The two discs are aligned (103) to each other and are connected by disc bonding (104). The electrical interconnections are formed between cavity disc and circuitry disc when bond process is not done through disc. The completion of element is enabled by standard methods of structure and connection technique.