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Monitoring distribution of galvanizing currents, comprises using direct current without electrical ripple or as unipolar or bipolar pulse current to electrode in electroplating systems as immersion bath or drum systems
Monitoring distribution of galvanizing currents, comprises using direct current without electrical ripple or as unipolar or bipolar pulse current to electrode in electroplating systems as immersion bath or drum systems
Monitoring the distribution of galvanizing currents, comprises using a direct current without electrical ripple or as unipolar or bipolar pulse current to the electrode (2) in electroplating systems as immersion bath or drum systems, and on horizontal and vertical continuous electroplating equipment and anodizing plants. The two electrical conductors, for symmetry reasons have same size for electroplating currents at their accuracy or parallel depending on the circuit. The current is directed to an electronic measuring device by a single feed-through current transformers. Monitoring the distribution of galvanizing currents, comprises using a direct current without electrical ripple or as unipolar or bipolar pulse current to the electrode (2) in electroplating systems as immersion bath or drum systems, and on horizontal and vertical continuous electroplating equipment and anodizing plants. The two electrical conductors, for symmetry reasons have same size for electroplating currents at their accuracy or parallel depending on the circuit. The current is directed to an electronic measuring device by a single feed-through current transformers or looping current transformers (7). An independent claim is also included for device for monitoring the distribution of galvanizing currents as a direct current, comprising a measuring device with a feed-through current transformer or a looping current transformer through which anodic or cathodic galvanizing electrical currents to be monitored, are guided in their current direction opposite to conductors.
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