首页> 外国专利> Film coating plant for packaging e.g. chips, has heated shells which are arranged between electrodes to receive clamping metal, and clamping device that is arranged within vacuum chamber to bias first electrode towards second electrode

Film coating plant for packaging e.g. chips, has heated shells which are arranged between electrodes to receive clamping metal, and clamping device that is arranged within vacuum chamber to bias first electrode towards second electrode

机译:包装用薄膜涂布设备芯片,具有加热的壳体,其布置在电极之间以接收夹持金属;以及夹持装置,其布置在真空室内以使第一电极向第二电极偏置

摘要

The film coating plant (10) has a vacuum chamber (12) which is provided with a vaporizer (22) having a metal bath (23) to generate metal vapor. A film (24) is guided on a coating roller (18) over the vaporizer to perform vapor deposition of metal. One side of vaporizer is provided with first electrodes while other side is provided with second electrodes. Heated shells are arranged between electrodes to receive clamping metal. A clamping device is arranged within vacuum chamber to bias first electrode towards second electrode.
机译:膜涂布设备(10)具有真空室(12),该真空室设有具有金属浴(23)以产生金属蒸汽的蒸发器(22)。膜(24)在蒸发器上方的涂布辊(18)上被引导以进行金属的气相沉积。蒸发器的一侧设置有第一电极,而另一侧设置有第二电极。加热的外壳布置在电极之间,以容纳夹紧金属。夹持装置布置在真空室内以使第一电极朝向第二电极偏置。

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