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Film coating plant for packaging e.g. chips, has heated shells which are arranged between electrodes to receive clamping metal, and clamping device that is arranged within vacuum chamber to bias first electrode towards second electrode
Film coating plant for packaging e.g. chips, has heated shells which are arranged between electrodes to receive clamping metal, and clamping device that is arranged within vacuum chamber to bias first electrode towards second electrode
The film coating plant (10) has a vacuum chamber (12) which is provided with a vaporizer (22) having a metal bath (23) to generate metal vapor. A film (24) is guided on a coating roller (18) over the vaporizer to perform vapor deposition of metal. One side of vaporizer is provided with first electrodes while other side is provided with second electrodes. Heated shells are arranged between electrodes to receive clamping metal. A clamping device is arranged within vacuum chamber to bias first electrode towards second electrode.
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