首页> 外国专利> Controlling temperature of band-shaped substrates e.g. substrate sheets, comprises directly heating guide segment arranged in channels by heating or cooling elements or by passing heating or cooling elements through channels

Controlling temperature of band-shaped substrates e.g. substrate sheets, comprises directly heating guide segment arranged in channels by heating or cooling elements or by passing heating or cooling elements through channels

机译:带状基板的温度控制例如基材片包括直接加热引导段,该加热引导段通过加热或冷却元件或通过使加热或冷却元件通过通道而布置在通道中

摘要

The method comprises directly heating a guide segment (21) arranged in channels by heating or cooling elements or by passing the heating or cooling elements through the channels. The heating step is carried out by a guide surface space apart from the heating or cooling elements. An independent claim is included for a device for temperature control of band-shaped substrates.
机译:该方法包括通过加热或冷却元件或使加热或冷却元件穿过通道直接加热布置在通道中的引导段(21)。加热步骤通过与加热或冷却元件分开的引导表面空间进行。包括对带状基板的温度控制的装置的独立权利要求。

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