Measuring temperature distribution in reflow soldering furnace, comprises measuring temperature of furnace by introducing test plate into printed circuit boards, and attaching a dummy of a structural member on upper side of the test plate

摘要

The method of measuring temperature distribution in a reflow soldering furnace, comprises measuring a temperature of the soldering furnace by introducing a test plate into printed circuit boards. The measuring step includes measures temperature on an upper side (30) of the test plate and in an air at a level of the test plate. The method further comprises attaching a dummy (39) of a structural member on the upper side of the test plate, and measuring a temperature in a through-hole in the plate. The test plate is configured for calibration of a reflow soldering furnace. The method of measuring temperature distribution in a reflow soldering furnace, comprises measuring a temperature of the soldering furnace by introducing a test plate into printed circuit boards. The measuring step includes measures temperature on an upper side (30) of the test plate and in an air at a level of the test plate. The method further comprises attaching a dummy (39) of a structural member on the upper side of the test plate, and measuring a temperature in a through-hole in the plate. The test plate is configured for calibration of a reflow soldering furnace. The temperatures are measured with known process parameters of the reflow soldering process in a first measuring process. The temperatures of the first measurement process compared to the temperatures of the later measurement process are varied so that deviations decrease between the temperatures. The first measuring process in a first reflow soldering furnace and the further measuring process in a further reflow soldering furnace are adjusted by varying the process parameters of the reflow soldering process. An independent claim is included for a test plate.