首页> 外国专利> Method for manufacturing planar thin heat pipe for cooling CPUs, involves pressing pipe thin by mechanical processing, completely adhering capillary structure at inner wall of pipe, evacuating pipe, filling pipe with fluid, and closing pipe

Method for manufacturing planar thin heat pipe for cooling CPUs, involves pressing pipe thin by mechanical processing, completely adhering capillary structure at inner wall of pipe, evacuating pipe, filling pipe with fluid, and closing pipe

机译:用于冷却CPU的平面细热管的制造方法,包括通过机械加工将细管压制,将毛细管结构完全粘附在管的内壁,排空管,向流体填充管以及封闭管

摘要

The method involves providing a pipe (2) and a net-like capillary structure (3). The structure is inserted into the pipe. An aid is provided and pushed into the structure. The pipe is sintered so that the structure is sintered at an inner wall of the pipe, and the aid is pulled out. The pipe is pressed thin by mechanical processing using a punching machine or a rolling machine, and the structure in the pipe is simultaneously pressed thin with the pipe. The structure is completely adhered at the inner wall. The pipe is evacuated, filled with working fluid, and closed.
机译:该方法包括提供管道(2)和网状毛细管结构(3)。该结构已插入管道中。提供辅助工具并将其推入结构中。烧结管,使得在管的内壁处烧结结构,并拉出辅助材料。通过使用冲压机或轧制机的机械加工将管压薄,并且同时将管中的结构与管压薄。该结构完全粘附在内壁上。排空管道,填充工作流体,然后关闭。

著录项

  • 公开/公告号DE102013002439A1

    专利类型

  • 公开/公告日2014-08-07

    原文格式PDF

  • 申请/专利权人 ASIA VITAL COMPONENTS CO. LTD.;

    申请/专利号DE20131002439

  • 发明设计人 WU CHUN-MING;

    申请日2013-02-06

  • 分类号B23P15/26;F28D15/02;B21D53/02;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:30

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