首页> 外国专利> Microfluidic system and process for its production, which comprises cavities closed on outside, channels, holes, depressions, preferably geometric functional elements; and first microfluidic component which is sealed with second foil

Microfluidic system and process for its production, which comprises cavities closed on outside, channels, holes, depressions, preferably geometric functional elements; and first microfluidic component which is sealed with second foil

机译:微流体系统及其生产方法,其包括在外部封闭的腔,通道,孔,凹陷,优选为几何功能元件;和第一微流体组分,其被第二箔密封

摘要

Microfluidic system and process for its production, are claimed. The microfluidic system comprises: cavities closed on outside, channels, holes, depressions, preferably geometric functional elements; and at least one first microfluidic component, which is sealed with a second foil or thin plates or thin components. The areas of the cavities, channels, holes are not included in closure area and thin plate or thin component is locked up with a third foil lying over it. The second foil or thin plates or thin components achieves a direct material connection for the first microfluidic component. Microfluidic system and process for its production, are claimed. The microfluidic system comprises: cavities closed on the outside, channels, holes, depressions, preferably geometric functional elements; and at least one first microfluidic component, which is sealed with a second foil or thin plates or thin components. The areas of the cavities, channels, holes are not included in the closure area and thin plate or thin component is locked up with a third foil lying over it. The second foil or thin plates or thin components achieves a direct material connection for the first microfluidic component. The thin plate or thin component achieves indirect bonded connection to the third film.
机译:要求保护微流体系统及其生产方法。该微流体系统包括:外部封闭的腔,通道,孔,凹陷,优选为几何功能元件;至少一个第一微流体组分,其被第二箔或薄板或薄组分密封。封闭区域中不包括空腔,通道,孔的区域,薄板或薄部件用位于其上方的第三箔纸锁定。第二箔或薄板或薄部件实现了用于第一微流体部件的直接材料连接。要求保护微流体系统及其生产方法。该微流体系统包括:外部封闭的腔,通道,孔,凹陷,优选为几何功能元件;至少一个第一微流体组分,其被第二箔或薄板或薄组分密封。空腔,通道,孔的区域不包括在封闭区域中,薄板或薄组件通过位于其上方的第三箔片锁定。第二箔或薄板或薄部件实现了用于第一微流体部件的直接材料连接。薄板或薄部件实现与第三膜的间接粘结连接。

著录项

  • 公开/公告号DE102013002667A1

    专利类型

  • 公开/公告日2014-08-21

    原文格式PDF

  • 申请/专利权人 MICROFLUIDIC CHIPSHOP GMBH;

    申请/专利号DE20131002667

  • 发明设计人 SCHMIDT STEFANIE;WEINZIERL UWE;

    申请日2013-02-15

  • 分类号B81B1/00;B81C1/00;B29C65/02;B32B27/08;B32B37/30;B01J19/24;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:29

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