MOLD RESIN INJECTION MOLDING DIE EQUIPPED WITH EJECTOR GUIDE STRUCTURE ALLOWING MOVEMENT OF EJECTOR GUIDE BUSH IN HORIZONTAL DIRECTION

摘要

PROBLEM TO BE SOLVED: To prevent deformation of an ejector guide pin generated due to thermal expansion difference between a movable die and ejector plates.;SOLUTION: Ejector plates 40, 50 are moved forward and backward while keeping to be parallel to a movable die 130 through guiding slidable an ejector guide pin 81 by an ejector guide bush 82 mounted to the ejector plates 40, 50. The ejector guide bush 82 is mounted as slidable to the ejector plates 40, 50, and horizontal clearances x, y are formed between the ejector guide bush 82 and open holes 42, 52 of the ejector plates 40, 50. Thus, even if thermal expansion difference is generated between the movable die 130 and the ejector plates 40, 50, no deformation like bending etc. is generated in the ejector guide pin 81 because the ejector guide pin 81 and the ejector plates 40, 50 do not butt to each other.;COPYRIGHT: (C)2015,JPO&INPIT