THIN FILM PLATING METHOD IMPROVING ANTICORROSION

摘要

PROBLEM TO BE SOLVED: To solve problems that, for example, in multilayer plating using only a DC power supply, a plating layer becomes thicker.;SOLUTION: A metallic substrate serving as a cathode is immersed in an electrolyte, electrical plating using a high speed current inversion power supply and electrical plating using a DC power supply, are alternately performed for performing multilayer plating, and plating layers are sequentially formed on minute, uniform, and thin plating layers, thereby the multilayer plating becomes thinner, overall.;COPYRIGHT: (C)2016,JPO&INPIT