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BOARD INSPECTION METHOD, BOARD INSPECTION APPARATUS, INSPECTION TOOL, AND INSPECTION TOOL SET

机译:板检查方法,板检查装置,检查工具和检查工具组

摘要

PROBLEM TO BE SOLVED: To provide a board inspection method, a board inspection apparatus, an inspection tool, and an inspection tool set for easily detecting defects in through holes even if a plurality of through holes for connecting plane patterns are provided.SOLUTION: A board inspection method includes: a first current supply process for allowing an inspection current Is to flow between a first position P1 for making continuity with a through hole TH near the through hole TH on a plane pattern 103 of a first surface 101 and a second position P2 for making continuity with the through hole TH near a through hole on a plane pattern 104 of a second surface 102; a first voltage detection process for detecting, as a first voltage V1, a voltage between a third position P3 for making continuity with the thorough hole TH near the through hole TH on the plane pattern 103 during execution of a first current supply process and a fourth position for making continuity with the through hole TH near the through hole TH on the plane pattern 104; and a determination process for determining whether the through hole TH is appropriate on the basis of the first voltage V1.
机译:解决的问题:提供一种基板检查方法,一种基板检查装置,一种检查工具和一种检查工具组,即使提供了多个用于连接平面图案的通孔,该工具也可以容易地检测出通孔中的缺陷。基板检查方法包括:第一电流供应过程,其允许检查电流Is在第一位置P1与第二位置之间流动,该第一位置P1与在第一表面101的平面图案103上的通孔TH附近的通孔TH连续并连续。 P2用于与第二表面102的平面图案104上的通孔附近的通孔TH连续;第一电压检测过程,用于在执行第一电流供应过程期间检测第三位置P3与第四位置之间的电压作为第一电压V1,所述第三位置P3与平面图案103上的通孔TH附近的通孔TH连续,该第三位置平面图案104上的通孔TH附近的通孔TH连续的位置。确定过程用于基于第一电压V1确定通孔TH是否合适。

著录项

  • 公开/公告号JP2015158436A

    专利类型

  • 公开/公告日2015-09-03

    原文格式PDF

  • 申请/专利权人 NIDEC-READ CORP;

    申请/专利号JP20140033595

  • 发明设计人 DOI NOBUYASU;

    申请日2014-02-25

  • 分类号G01R31/02;H05K3;

  • 国家 JP

  • 入库时间 2022-08-21 15:34:26

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