首页> 外国专利> SILVER REDUCED IN α RAYS AMOUNT, ALLOY CONTAINING THE SAME AND METHOD OF PRODUCING THE SAME

SILVER REDUCED IN α RAYS AMOUNT, ALLOY CONTAINING THE SAME AND METHOD OF PRODUCING THE SAME

机译:含α射线的合金中含银量减少的银及其生产方法

摘要

PROBLEM TO BE SOLVED: To solve the problem that the requirements of high purities of solder materials and silver used close to semiconductor devices and availability of materials reduced in α rays amount are high and provide silver whose sample after melting and casting has an α rays amount of 0.002cph/cm2 or smaller.;SOLUTION: An Sn-Cu-Ag alloy is produced by exuding raw silver of a purity level of 3N with nitric or sulfuric acid, refining electrolytically with an electrolytic solution of an Ag concentration of 700 g/L or lower, increasing the purities of commercial tin and copper to high levels by electrolysis to obtain 5N-Sn and 6N-Cu and adding the silver and copper to the tin as additive elements and melting and casting at 260°C to obtain an Sn-Cu-Ag alloy comprising 0.5% Cu, 3% Ag and remaining Sn.;COPYRIGHT: (C)2015,JPO&INPIT
机译:要解决的问题:解决对半导体器件附近使用的焊料材料和银的高纯度要求以及降低α射线量的材料的可用性的问题,并提供熔化和铸造后的样品具有α射线量的银。 0.002cph / cm 2 或更小。;解决方案:锡-铜-银合金是通过将纯度为3N的生银与硝酸或硫酸一起渗出,然后用电解溶液电解精制而成的Ag的浓度为700 g / L或更低,通过电解获得5N-Sn和6N-Cu并将银和铜添加到锡中作为添加元素并熔化和铸造,从而将商业化的锡和铜的纯度提高到高水平。在260°C下获得含0.5%Cu,3%Ag和剩余Sn的Sn-Cu-Ag合金。版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015028215A

    专利类型

  • 公开/公告日2015-02-12

    原文格式PDF

  • 申请/专利权人 JX NIPPON MINING & METALS CORP;

    申请/专利号JP20140154928

  • 发明设计人 KANO MANABU;OMORI TATSUYA;

    申请日2014-07-30

  • 分类号C22C5/06;C22C13/00;C25C1/20;B23K1/00;

  • 国家 JP

  • 入库时间 2022-08-21 15:34:22

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