首页> 外国专利> ELECTROCONDUCTIVE PASTE FOR LASER ETCHING PROCESSING, ELECTRIC CIRCUIT, AND TOUCH PANEL

ELECTROCONDUCTIVE PASTE FOR LASER ETCHING PROCESSING, ELECTRIC CIRCUIT, AND TOUCH PANEL

机译:激光蚀刻加工,电路和触摸屏的导电胶

摘要

PROBLEM TO BE SOLVED: To provide electroconductive paste for laser etching processing, which paste can allow high-density electrode circuit wiring of 50/50 m or smaller L/S, which would not be dealed with the conventional screen printing method, to be produced at a low cost and under a low environmental load and which paste is made suitable for laser etching processing.SOLUTION: The electroconductive paste for laser etching processing contains a binder resin (A) comprising a thermoplastic resin, metal powder (B) and an organic solvent (C) and is used for forming the circuit wiring of a touch panel, which wiring has 50/50 m or smaller L/S, by laser etching processing. An electric circuit and the touch panel, each of which is formed by using the electroconductive paste, are also provided.
机译:解决的问题:提供用于激光蚀刻处理的导电浆料,该浆料可以生产50/50 m或更小的L / S的高密度电极电路布线,这是常规丝网印刷方法所不能解决的。解决方案:用于激光蚀刻加工的导电浆料包含一种粘结剂树脂(A),该粘结剂树脂包括热塑性树脂,金属粉末(B)和一种有机材料。溶剂(C),用于通过激光蚀刻加工形成L / S为50 / 50m以下的触摸面板的电路布线。还提供了分别通过使用导电膏形成的电路和触摸面板。

著录项

  • 公开/公告号JP2015135817A

    专利类型

  • 公开/公告日2015-07-27

    原文格式PDF

  • 申请/专利权人 TOYOBO CO LTD;

    申请/专利号JP20150019054

  • 发明设计人 HAMAZAKI AKIRA;OMAE SHINTARO;

    申请日2015-02-03

  • 分类号H01B1/22;H01B5/14;H01B13;

  • 国家 JP

  • 入库时间 2022-08-21 15:34:22

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