BONDABILITY EVALUATION DEVICE AND BONDABILITY EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To improve evaluation accuracy of bondability while shortening a time required for the evaluation of the bondability of an adhesive layer of an evaluation object.;SOLUTION: A bonding end position specification part 53 specifies end positions Ad1_L, Ad1_R, Ad2_L, and Ad2_R of bonding normal ranges Ad1 and Ad2 on a scanning line 39 on the basis of an ultrasonic intensity distribution on the scanning line 39 in a bondability evaluation region 37. A normal bonding range specification part 57 sets a temperature threshold τ0 on the basis of difference temperatures of pixels corresponding to the end positions Ad1_L, Ad1_R, Ad2_L, and Ad2_R, and specifies a normal bonding area in the bondability evaluation region 37 by comparing the difference temperatures corresponding to the respective pixels with the temperature threshold τ0.;COPYRIGHT: (C)2015,JPO&INPIT