FILM-LIKE ADHESIVE, DICING TAPE INTEGRATED FILM-LIKE ADHESIVE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a film-like adhesive which can withstand heat generated by a semiconductor element and the like, and can efficiently radiate the heat by the semiconductor element and the like to the outside, when being used in a semiconductor device.SOLUTION: A film-like adhesive for a semiconductor device contains a thermosetting resin, a curing agent and conductive particles, and has a glass transition temperature of 130°C or higher after heat curing.