LEAD FRAME, LEAD FRAME WITH RESIN, MULTIFACETED BODY OF LEAD FRAME, MULTIFACETED BODY OF LEAD FRAME WITH RESIN, OPTICAL SEMICONDUCTOR DEVICE, MULTIFACETED BODY OF OPTICAL SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a lead frame in which occurrence of peeling of each terminal and a resin layer can be suppressed between terminals, and to provide a lead frame with resin, a multifaceted body of lead frame, a multifaceted body of lead frame with resin, an optical semiconductor device, and a multifaceted body of an optical semiconductor device.SOLUTION: In a lead frame 10 used for an optical semiconductor device 1 and having a plurality of terminals 11, 12, provided with terminal surfaces on the front and back, at least one of which is connected with an optical semiconductor element 2, each terminal 11, 12 has a step D formed to drop from the outer peripheral edge of the outer terminal surface 11b, 12b, at the outer periphery of the sides facing each other on the back. The step D has a protrusion T protruding from the dropping region.