首页> 外国专利> SUBSTRATE FOR PIEZOELECTRIC OSCILLATOR, PIEZOELECTRIC OSCILLATOR, AND METHOD OF FABRICATING PIEZOELECTRIC OSCILLATOR

SUBSTRATE FOR PIEZOELECTRIC OSCILLATOR, PIEZOELECTRIC OSCILLATOR, AND METHOD OF FABRICATING PIEZOELECTRIC OSCILLATOR

机译:压电振荡器的基板,压电振荡器以及制造压电振荡器的方法

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a piezoelectric oscillator that can achieve reduction in size or thickness at a low cost.SOLUTION: A substrate 5 for an oscillator 1 is a substrate on which a vibration element 7 and an integrated circuit element 9 including an oscillation circuit are mounted on a first main surface 13a side by side. The substrate 5 is a single-layer substrate, and includes: a predetermined number of external terminals provided on a second main surface 13b, the predetermined number being two or more; a pair of vibration-element-pads 19 that are provided on the first main surface 13a and on which the vibration element 7 is to be mounted; a predetermined number of first integrated-circuit-element-pads 21 and a pair of second integrated-circuit-element-pads 23 that are provided on the first main surface 13a and are connected with the integrated circuit element 9; a predetermined number of front-back connection conductors 17 that extend in a thickness direction of an insulating substrate 13 from the predetermined number of external terminals and are exposed on the first main surface 13a; and a predetermined number of first interconnections 37, a pair of second interconnections 39, and a pair of cutting patterns 41 that are provided on the first main surface 13a and connects the predetermined number of external terminals, the pair of vibration-element-pads 19, the predetermined number of first integrated-circuit-element-pads 21 and the pair of second integrated-circuit-element-pads 23, and the predetermined number of front-back connection conductors 17.
机译:解决的问题:提供一种可以以低成本实现尺寸减小或厚度减小的压电振荡器的基板。解决方案:振荡器1的基板5是其上具有振动元件7和集成电路元件9的基板。在第一主表面13a上并排安装有包括振荡电路的电路。基板5是单层基板,并且包括:预定数量的外部端子,设置在第二主表面13b上,预定数量为两个或更多个;一对振动元件垫19,其设置在第一主表面13a上并且将振动元件7安装在其上;预定数量的第一集成电路元件焊盘21和一对第二集成电路元件焊盘23设置在第一主表面13a上并与集成电路元件9连接;预定数量的前后连接导体17从预定数量的外部端子沿绝缘基板13的厚度方向延伸,并且在第一主表面13a上露出。一对振动元件垫19;以及预定数量的第一互连37,一对第二互连39和一对切割图案41,其设置在第一主表面13a上并连接预定数量的外部端子。预定数量的第一集成电路元件焊盘21和一对第二集成电路元件焊盘23,以及预定数量的前后连接导体17。

著录项

  • 公开/公告号JP2015126533A

    专利类型

  • 公开/公告日2015-07-06

    原文格式PDF

  • 申请/专利权人 KYOCERA CRYSTAL DEVICE CORP;

    申请/专利号JP20130272445

  • 发明设计人 KENJO SEISHI;

    申请日2013-12-27

  • 分类号H03B5/32;

  • 国家 JP

  • 入库时间 2022-08-21 15:32:12

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