首页> 外国专利> Fiber bundles inorganic fibers , and composite materials for the inorganic fiber bundles composed of the fiber bundles for the inorganic fibers and ceramic matrix composite material reinforced with the fiber bundles .

Fiber bundles inorganic fibers , and composite materials for the inorganic fiber bundles composed of the fiber bundles for the inorganic fibers and ceramic matrix composite material reinforced with the fiber bundles .

机译:纤维束无机纤维,无机纤维束的复合材料,由无机纤维束和纤维束增强的陶瓷基复合材料组成。

摘要

PROBLEM TO BE SOLVED: To provide an inorganic fiber for fiber bundle which forms an interface layer on the whole surface of the fiber at an interface between matrix and the fiber and suppresses the decrease of fiber strength due to the damage of the fiber in the manufacturing process of an inorganic fiber bundle for composite material and avoids the contact between the fibers in the fiber bundle in the manufacturing process of a composite material in order to obtain a ceramic-based composite material having sufficient strength and destruction energy and showing excellent durability when it is subjected to the stress under high temperature and oxidative atmosphere.SOLUTION: An inorganic fiber for fiber bundle is an inorganic fiber for fiber bundle which composes an inorganic fiber bundle for composite material in which the diameter of the fiber varies in a longitudinal direction. Preferably, it is a silicon carbide-based fiber having a specific difference between a maximum diameter and a minimum diameter of 2 to 6 μm and having a pitch of variation of 10 to 200 mm.
机译:解决的问题:提供一种用于纤维束的无机纤维,该无机纤维在基体与纤维之间的界面处在纤维的整个表面上形成界面层,并抑制由于纤维在制造过程中的损坏而导致的纤维强度降低。用于复合材料的无机纤维束的制备方法,并且避免了在复合材料的制造过程中纤维束中的纤维之间的接触,从而获得具有足够强度和破坏能并在其显示出优异耐久性时的陶瓷基复合材料解决方案:纤维束用无机纤维是指纤维束用无机纤维,由无机纤维束组成,复合材料的纤维直径沿纵向变化。优选地,它是基于碳化硅的纤维,其最大直径与最小直径之间的特定差为2至6μm,并且具有10至200mm的变化节距。

著录项

  • 公开/公告号JP5668550B2

    专利类型

  • 公开/公告日2015-02-12

    原文格式PDF

  • 申请/专利权人 宇部興産株式会社;

    申请/专利号JP20110059269

  • 发明设计人 鈴木 道之;清水 和敏;

    申请日2011-03-17

  • 分类号D01F9/10;C04B35/80;

  • 国家 JP

  • 入库时间 2022-08-21 15:30:14

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